OpenJournalRank

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

International Microelectronics Assembly and Packaging Society · United States

ISSN-L
2380-4491
OpenAlex ID
S4210189957
APC list price
Not listed
Full statisticsSubscription or hybridCore list

2025: no OJR in this release. Latest calculable OJR: 1.06 in 2024. Last eligible ranking: Q3 in Electrical and Electronic Engineering, 2022.

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) has no quartile in OpenJournalRank’s 2025 ranking. OJR quartiles are calculated independently of SCImago, Scopus and JCR quartiles.